Assignment of Assignor's Interest

Recorded: 2022-11-03 Pages: 7

Assignors

MCKNIGHT-MACNEIL, CAMERON

Executed: 2022-09-27

DIXIT, ABHINANDAN

Executed: 2022-09-20

MIZAN, AHAMD

Executed: 2022-10-19

CHENG, AN-SHENG

Executed: 2022-09-21

Assignee

GAN SYSTEMS INC.

SUITE 201, 770 PALLADIUM DRIVE, KANATA, K2V1C8, CANADA

Covered Property (1)

Fabrication of Embedded Die Packaging Comprising Laser Drilled Vias

Application: 17/945,231 →

Publication: US 2023/0019052

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.