Patent Assignment
Reel/Frame 061890/0869
Assignment of Assignor's Interest
Recorded: 2022-11-28
Pages: 8
Assignors
YOSHINO, TERUO
Executed: 2022-03-06
OHASHI, NAOFUMI
Executed: 2020-03-08
TAKASAKI, TADASHI
Executed: 2022-03-04
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 1010045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device, and Non-Transitory Computer-Readable Recording Medium