Assignment of Assignor's Interest

Recorded: 2022-11-28 Pages: 8

Assignors

CHEN, CHUN-WEI

Executed: 2022-11-21

KO, MING-YIN

Executed: 2022-11-21

LUO, YAN-BIN

Executed: 2022-11-22

Assignee

AIROHA TECHNOLOGY CORP.

5 F., NO. 6-5, DUXING RD., EAST DIST., HSINCHU CITY, TAIWAN

Covered Property (1)

Semiconductor Package Having Ground Bonding Wire That Crosses Over Signal Bonding Wire for Crosstalk Reduction and Associated Method

Application: 18/070,406 →

Publication: US 2023/0402818