Patent Assignment
Reel/Frame 061922/0077
Assignment of Assignor's Interest
Recorded: 2022-11-30
Pages: 3
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in FO-WLCSP
Application:
18/060,115 →
Publication:
US 2023/0096463