Patent Assignment
Reel/Frame 061977/0876
Assignment of Assignor's Interest
Recorded: 2022-12-05
Pages: 7
Assignors
CHOI, SE YOUNG
Executed: 2022-10-06
KIM, YONG GOOG
Executed: 2022-10-06
SIM, SOO YEON
Executed: 2022-10-06
HWANG, JA YOUNG
Executed: 2022-10-06
KIM, JEONG HEE
Executed: 2022-10-06
CHO, YOUN JIN
Executed: 2022-10-06
Assignee
SAMSUNG SDI CO., LTD.
150-20, GONGSE-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, 17084, KOREA, REPUBLIC OF
Covered Property
(1)
Compound, Cmp Slurry Composition Including the Same and Polishing Method Using the Same
Application:
18/074,856 →
Publication:
US 2023/0227695