Patent Assignment
Reel/Frame 062133/0447
Assignment of Assignor's Interest
Recorded: 2022-12-18
Pages: 5
Assignors
COLGAN, EVAN
Executed: 2022-12-17
NAH, JAE-WOONG
Executed: 2022-12-17
SAKUMA, KATSUYUKI
Executed: 2022-12-16
SIKKA, KAMAL K.
Executed: 2022-12-17
RUBIN, JOSHUA M.
Executed: 2022-12-18
LIBSCH, FRANK ROBERT
Executed: 2022-12-18
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Thermal Expansion Matched Chip Module with Integrated Liquid Cooling
Application:
18/083,554 →
Publication:
US 2024/0203822