IP Library Assignment 062186/0687
Patent Assignment
Reel/Frame 062186/0687

Assignment of Assignor's Interest

Recorded: 2022-12-22 Pages: 4
Assignors
MATSUI, KAZUMA
Executed: 2022-10-31
OKA, YUKI
Executed: 2022-10-31
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Plasma Etching Method and Method for Manufacturing Semiconductor Element
Application: 18/012,445 →
Publication: US 2024/0038546
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 15, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 065593/0496 →