Patent Assignment
Reel/Frame 062213/0217
Assignment of Assignor's Interest
Recorded: 2022-12-27
Pages: 5
Assignors
KANG, MIN GI
Executed: 2022-12-23
WOO, HYUK
Executed: 2022-12-23
PARK, TAE YOUNG
Executed: 2022-12-23
LEE, JU HWAN
Executed: 2022-12-23
JO, SEON HYEONG
Executed: 2022-12-23
YUN, SEONG HWAN
Executed: 2022-12-23
KIM, TAE YANG
Executed: 2022-12-23
Assignee
HYUNDAI MOBIS CO., LTD.
203, TEHERAN-RO, GANGNAM-GU, SEOUL, 06141, KOREA, REPUBLIC OF
Covered Property
(1)
Power Semiconductor Device, Power Semiconductor Chip Including the Same, and Method for Manufacturing the Same