Patent Assignment
Reel/Frame 062312/0066
Assignment of Assignor's Interest
Recorded: 2023-01-09
Pages: 7
Assignors
KITAMURA, MASAHIRO
Executed: 2022-10-18
KAMIMURA, TAKUROH
Executed: 2022-10-20
HASHIBA, JUNKI
Executed: 2022-10-18
ADACHI, TAKATERU
Executed: 2022-10-18
Assignee
LENOVO (SINGAPORE) PTE. LTD.
151 LORONG CHUAN, #02-01 NEW TECH PARK, SINGAPORE, 556741, SINGAPORE
Covered Property
(1)
Heat Dissipation Structure, Manufacturing Method for Heat Dissipation Structure, and Electronic Apparatus
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.