Patent Assignment
Reel/Frame 062315/0066
Assignment of Assignor's Interest
Recorded: 2023-01-09
Pages: 9
Assignors
CHAKRAVARTY, SREEJIT
Executed: 2022-07-14
KASHYAP, ADITHYA
Executed: 2022-07-22
CHELLI, VIJAYA
Executed: 2022-07-21
SHAHAR, MICHA
Executed: 2022-07-22
KANDULA, RAKESH
Executed: 2022-07-14
AMOSI, DOVEV
Executed: 2022-08-22
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Test and Repair of Interconnects Between Chips
Application:
17/871,807 →
Publication:
US 2024/0027516