Patent Assignment
Reel/Frame 062340/0351
Assignment of Assignor's Interest
Recorded: 2023-01-11
Pages: 5
Assignors
CHEN, YI-HUAN
Executed: 2022-09-05
YUAN, HUAN-CHIH
Executed: 2022-08-25
JONG, YU-CHANG
Executed: 2022-08-25
YEH, SCOTT
Executed: 2022-12-21
CHEN, FEI-YUN
Executed: 2022-09-07
CHEN, YI-HAO
Executed: 2022-12-21
CHOU, TING-WEI
Executed: 2022-08-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Hybrid Fin-Dielectric Semiconductor Device
Application:
17/895,323 →
Publication:
US 2024/0071833