Assignment of Assignor's Interest

Recorded: 2023-01-17 Pages: 2

Assignor

Executed: 2022-11-18

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Method for Fabricating a Backside Through-Wafer via in a Processed Wafer and Related Structure

Patent: 8,212,331 →

Application: 11/787,063 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.