Patent Assignment
Reel/Frame 062455/0467
Assignment of Assignor's Interest
Recorded: 2023-01-23
Pages: 7
Assignors
KIM, KI HWAN
Executed: 2022-12-16
KIM, KYUNGHO
Executed: 2022-12-16
MOON, KANG HUN
Executed: 2022-12-16
LEE, CHOEUN
Executed: 2022-12-16
JEON, YOUNGUK
Executed: 2022-12-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129,SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same