Patent Assignment
Reel/Frame 062591/0056
Assignment of Assignor's Interest
Recorded: 2023-02-03
Pages: 10
Assignors
YANG, CHIH-WEI
Executed: 2023-01-09
FU, SSU-I
Executed: 2023-01-09
HSU, CHIH-KAI
Executed: 2023-01-09
LIN, CHUN-HSIEN
Executed: 2023-01-09
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same
Application:
18/105,798 →
Publication:
US 2024/0204085