Patent Assignment
Reel/Frame 062692/0048
Assignment of Assignor's Interest
Recorded: 2023-02-14
Pages: 8
Assignors
CHEN, DI
Executed: 2022-08-09
LU, JUNCHENG
Executed: 2022-08-03
MIZAN, AHMAD
Executed: 2022-08-04
HOU, RUOYU
Executed: 2022-12-01
DIXIT, ABHINANDAN
Executed: 2022-10-06
Assignee
GAN SYSTEMS INC.
SUITE 201, 770 PALLADIUM DRIVE, KANATA, K2V 1C8, CANADA
Covered Property
(1)
Dual-Side Cooled Embedded Die Packaging for Power Semiconductor Devices
Application:
18/094,477 →
Publication:
US 2023/0402342
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.