Patent Assignment
Reel/Frame 062730/0616
Assignment of Assignor's Interest
Recorded: 2022-12-14
Pages: 4
Assignor
JEONG, KWANGOK
Executed: 2022-06-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having Upper Conductive Patterns
Application:
17/979,233 →
Publication:
US 2023/0142267