Patent Assignment
Reel/Frame 062736/0902
Assignment of Assignor's Interest
Recorded: 2023-02-17
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing a Semiconductor Package and Semiconductor Package Manufactured by the Same