Patent Assignment
Reel/Frame 062744/0467
Assignment of Assignor's Interest
Recorded: 2023-02-20
Pages: 5
Assignors
CHIU, TZU-WEI
Executed: 2023-02-07
CHANG, CHUN-WEI
Executed: 2023-02-07
CHEN, SHANG-PIN
Executed: 2023-02-07
CHEN, WEI-CHIH
Executed: 2023-02-07
HUANG, CHE-YEN
Executed: 2023-02-16
Assignee
SERIPHY TECHNOLOGY CORPORATION
7F.-5, NO. 168, SEC. 2, FUXING 3RD RD., ZHUBEI CITY, HSINCHU COUNTY, 30273, TAIWAN
Covered Property
(1)
Semiconductor Structures and Method for Manufacturing a Semiconductor Structure
Application:
18/171,532 →
Publication:
US 2024/0120282