Patent Assignment
Reel/Frame 062764/0939
Assignment of Assignor's Interest
Recorded: 2023-02-22
Pages: 3
Assignors
RIEGLER, ANDREAS
Executed: 2023-02-01
GLANZER, BARBARA ANGELA
Executed: 2023-02-01
FACHMANN, CHRISTIAN
Executed: 2023-02-03
Assignee
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2, VILLACH, 9500, AUSTRIA
Covered Property
(1)
Semiconductor Package Including a Chip-Substrate Composite Semiconductor Device