Patent Assignment
Reel/Frame 062780/0465
Assignment of Patent Security Interest Previously Recorded at Reel/Frame (038684/0563)
Recorded: 2023-02-17
Pages: 8
Assignor
HSBC BANK USA, NATIONAL ASSOCIATION, AS RESIGNING AGENT
Executed: 2023-02-10
Assignee
JPMORGAN CHASE BANK, N.A., AS SUCCESSOR AGENT
10 S. DEARBORN, FLOOR L2, CHICAGO, ILLINOIS, 60603
Covered Property
(1)
Semiconductor Device and Method of Forming DCALGA Package Using Semiconductor Die with Micro Pillars
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 29, 2015
From: CHINNUSAMY, SATYAMOORTHI; TAN, WENG HING; HO, KOK KHOON; PAN, ANDREW
To: SEMTECH CORPORATION
Reel/Frame 036918/0416 →
Security Interest
May 23, 2016
From: SEMTECH CORPORATION
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 038684/0563 →
Security Interest
Nov 17, 2016
From: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.; SEMTECH EV, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 040646/0799 →
Assignment of Patent Security Interest Previously Recorded at Reel/Frame (040646/0799)
Feb 17, 2023
From: HSBC BANK USA, NATIONAL ASSOCIATION, AS RESIGNING AGENT
To: JPMORGAN CHASE BANK, N.A., AS SUCCESSOR AGENT
Reel/Frame 062781/0544 →