Patent Assignment
Reel/Frame 062792/0930
Change of Name
Recorded: 2023-02-24
Pages: 11
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Sealing Material and Multilayered Glass Panel Using Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 12, 2020
From: NAITO, TAKASHI; TACHIZONO, SHINICHI; YOSHIMURA, KEI; HASHIBA, YUJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052927/0622 →
Change of Name
Nov 3, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061876/0752 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →