Patent Assignment
Reel/Frame 062895/0693
Assignment of Assignor's Interest
Recorded: 2023-03-06
Pages: 8
Assignors
HAN, KYU-HEE
Executed: 2023-02-07
BAEK, BONG KWAN
Executed: 2023-02-07
CHUN, JUNG HWAN
Executed: 2023-02-08
RYU, KOUNG MIN
Executed: 2023-02-08
BAEK, JONG MIN
Executed: 2023-02-08
SHIN, JUNG HOO
Executed: 2023-02-08
LIM, JUN HYUK
Executed: 2023-02-07
JANG, SANG SHIN
Executed: 2023-02-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device with Multi-Layer Contact Liner Structure
Application:
18/117,837 →
Publication:
US 2023/0395667