Patent Assignment
Reel/Frame 062922/0601
Assignment of Assignor's Interest
Recorded: 2023-03-08
Pages: 5
Assignors
LEE, JEONGHYUN
Executed: 2023-03-07
PARK, JIYONG
Executed: 2023-03-07
PARK, JINWOO
Executed: 2023-03-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same
Application:
18/180,563 →
Publication:
US 2024/0063106