Patent Assignment
Reel/Frame 062955/0221
Change of Name
Recorded: 2023-03-03
Pages: 4
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Bonded Structures with Integrated Passive Component
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 20, 2018
From: HABA, BELGACEM; MOHAMMED, ILYAS; KATKAR, RAJESH; GUEVARA, GABRIEL Z.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 044977/0971 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →