IP Library › Assignment 062968/0175
Patent Assignment
Reel/Frame 062968/0175

Change of Name

Recorded: 2023-03-07 Pages: 11
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Electronic Component, Conductive Paste, and Method for Manufacturing an Electronic Component
Patent: 9,786,463 →
Application: 13/581,178 →
Publication: US 2012/0318559
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 28, 2012
From: AOYAGI, TAKUYA; NAITO, TAKASHI; HASHIBA, YUJI; YOSHIMURA, KEI
To: HITACHI, LTD.; HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 028860/0415 →
Change of Address Sep 5, 2017
From: HITACHI CHEMICAL COMPANY LTD.
To: HITACHI CHEMICAL COMPANY LTD.
Reel/Frame 043750/0662 →
Change of Name Mar 6, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062956/0644 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →