Patent Assignment
Reel/Frame 063052/0740
Assignment of Assignor's Interest
Recorded: 2023-03-21
Pages: 3
Assignors
LIN, YUNG-CHI
Executed: 2023-03-07
CHUNG, MING-TSU
Executed: 2023-03-06
TSAI, YAN-ZUO
Executed: 2023-03-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same
Application:
18/186,202 →
Publication:
US 2024/0321694