Patent Assignment
Reel/Frame 063078/0806
Assignment of Assignor's Interest
Recorded: 2023-03-23
Pages: 4
Assignors
LEE, SEUNGHYUN
Executed: 2023-03-16
PARK, YEJIN
Executed: 2023-03-16
LEE, HEESOO
Executed: 2023-03-23
Assignee
JCET STATS CHIPPAC KOREA LIMITED
299, JAYUMUYEOK-RO, JUNG-GU, INCHEON, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Forming a 3-D Stacked Semiconductor Package Structure
Application:
18/188,844 →
Publication:
US 2024/0321783