Patent Assignment
Reel/Frame 063133/0987
Assignment of Assignor's Interest
Recorded: 2023-03-28
Pages: 5
Assignors
GUILLON, DAVID
Executed: 2022-05-16
BAYER, MARTIN
Executed: 2022-05-02
ROESCH, ANDREAS
Executed: 2022-05-04
SALVATORE, GIOVANNI
Executed: 2023-02-21
FISCHER, FABIAN
Executed: 2022-05-02
Assignee
HITACHI ENERGY SWITZERLAND AG
BRUGGERSTRASSE 72, BADEN, AARGAU, 5400, SWITZERLAND
Covered Property
(1)
Method for Manufacturing and Module of a Semiconductor Power Module with Heat Dissipation Function
Application:
18/029,020 →
Publication:
US 2024/0063080
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.