Patent Assignment
Reel/Frame 063201/0748
Assignment of Assignor's Interest
Recorded: 2023-04-03
Pages: 4
Assignors
SU, BO
Executed: 2023-03-28
ZHAO, ZHENYANG
Executed: 2023-03-28
ZHANG, HAIYANG
Executed: 2023-03-28
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
NO. 18 ZHANGJIANG ROAD, CHINA (SHANGHAI), PILOT FREE TRADE ZONE, ROADPUDONG NEW AREA, SHANGHAI, 201203, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
18 WENCHANG ROAD, BEIJING ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100176, CHINA
Covered Property
(1)
Semiconductor Structure and Forming Method Thereof