Patent Assignment
Reel/Frame 063408/0575
Assignment of Assignor's Interest
Recorded: 2023-04-22
Pages: 5
Assignors
YANG, MING-HSIEN
Executed: 2022-11-14
CHOU, CHUN-HAO
Executed: 2023-01-12
LEE, KUO-CHENG
Executed: 2023-01-17
CHIA, CHUN-WEI
Executed: 2023-01-29
LU, CHUN-LIANG
Executed: 2023-01-29
WENG, WEI-CHIH
Executed: 2023-01-29
CHIU, CHENG-HAO
Executed: 2023-01-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Multi-Layer Image Sensor Structure with Dark Current Sensing Photodiodes in Black Level Calibration Area Surrounded by Dual Seal Ring System and Opaque Cover with Integrated Trench Isolation
Application:
18/126,320 →
Publication:
US 2024/0006425