Patent Assignment
Reel/Frame 063430/0717
Assignment of Assignor's Interest
Recorded: 2023-04-25
Pages: 6
Assignors
PARK, JINWOO
Executed: 2023-02-15
KANG, MYUNGSUNG
Executed: 2023-02-15
YOO, JAEKYUNG
Executed: 2023-02-15
KANG, UNBYOUNG
Executed: 2023-02-15
LEE, CHUNGSUN
Executed: 2023-02-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Molding Apparatus of Semiconductor Package