IP Library › Assignment 063458/0098
Patent Assignment
Reel/Frame 063458/0098

Change of Name

Recorded: 2023-04-26 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (4)
Electrical Redundancy for Bonded Structures
Application: 17/129,632 →
Publication: US 2021/0193625
Circuitry for Electrical Redundancy in Bonded Structures
Application: 17/125,899 →
Publication: US 2021/0193603
Expansion Control for Bonding
Application: 63/334,580 →
Interconnect Structures
Application: 17/486,633 →
Publication: US 2022/0013456
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 10, 2021
From: DELACRUZ, JAVIER A.; HABA, BELGACEM; KO, JUNG
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 055219/0022 →
Assignment of Assignor's Interest Feb 10, 2021
From: KATKAR, RAJESH; HABA, BELGACEM
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 055220/0181 →
Assignment of Assignor's Interest Jul 21, 2022
From: UZOH, CYPRIAN EMEKA; ZHAO, OLIVER; LEE, BONGSUB; MIRKARIMI, LAURA WILLS
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 060578/0369 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →