Patent Assignment
Reel/Frame 063493/0979
Assignment of Assignor's Interest
Recorded: 2023-05-01
Pages: 7
Assignors
SATO, JUSTIN
Executed: 2021-01-25
CHEN, BOMY
Executed: 2021-01-27
LENG, YAOJIAN
Executed: 2021-01-25
MARSICO, GERALD
Executed: 2021-01-27
KOVATS, JULIUS
Executed: 2021-01-28
Assignee
MICROCHIP TECHNOLOGY INCORPORATED
2355 WEST CHANDLER BLVD., CHANDLER, ARIZONA, 85224-6199
Covered Property
(1)
Integrated Circuit Bond Pad with Multi-Material Toothed Structure