Patent Assignment
Reel/Frame 063500/0287
Loan Foreclosure and Intellectual Property Asset Transfer
Recorded: 2023-05-01
Pages: 25
Assignor
SONICSENSORY, INC.
Executed: 2022-09-23
Assignee
HAPTECH HOLDINGS, INC.
5179 KNOLLWOOD WAY, WOODLAND HILLS, CALIFORNIA, 91364
Covered Properties
(2)
A Modular System for Building Variable Interactive Platforms and Enclosures for Deep Multisensory Immersion into Audio and Audio-Visual Entertainment
Modular System for Building Variable Interactive Platforms and Enclosures for Deep Multisensory Immersion into Audio and Audio-Visual Entertainment
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 4, 2020
From: SEILER, BROCK MAXWELL
To: SONICSENSORY, INC.
Reel/Frame 053393/0313 →
Security Interest
Jan 22, 2021
From: SONICSENSORY, INC.
To: SILICON VALLEY BANK
Reel/Frame 054995/0553 →
Assignment of Assignor's Interest
Mar 8, 2023
From: SONICSENSORY, INC.
To: HAPTECH HOLDINGS, INC.
Reel/Frame 063822/0684 →
Corrective Assignment to Correct the Patent Number 11306127 Was Erroneously Included. It Is Not Part of This Conveyance Previously Recorded on Reel 063822 Frame 0684. Assignor(S) Hereby Confirms the Assignment of Assignors Interest.
Sep 15, 2023
From: SONICSENSORY, INC.
To: HAPTECH HOLDINGS, INC.
Reel/Frame 064918/0876 →