Patent Assignment
Reel/Frame 063506/0696
Assignment of Assignor's Interest
Recorded: 2023-05-02
Pages: 7
Assignors
KANSAL, PANKAJ
Executed: 2023-04-25
SRINIVASAN, ARVIND
Executed: 2023-04-25
REDDY, HARIKRISHNA MADADI
Executed: 2023-04-27
HASANI, NAADER
Executed: 2023-04-25
Assignee
META PLATFORMS, INC.
1601 WILLOW ROAD, MENLO PARK, CALIFORNIA, 94025
Covered Property
(1)
Chip-To-Chip Interconnect with a Layered Communication Architecture