Patent Assignment
Reel/Frame 063685/0877
Assignment of Assignor's Interest
Recorded: 2023-05-18
Pages: 3
Assignor
SMITH, JEFFREY
Executed: 2023-05-17
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Sequential Complimentary Fet Incorporating Backside Power Distribution Network Through Wafer Bonding Prior to Formation of Active Devices