Patent Assignment
Reel/Frame 063701/0390
Assignment of Assignor's Interest
Recorded: 2023-05-19
Pages: 6
Assignors
OH, SEUNGHA
Executed: 2023-02-07
HWANG, JAEWON
Executed: 2023-02-07
MOON, KWANGJIN
Executed: 2023-02-07
LEE, HOJIN
Executed: 2023-02-07
JEON, HYUNGJUN
Executed: 2023-02-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Semiconductor Device
Application:
18/199,541 →
Publication:
US 2024/0047305