IP Library Assignment 063777/0721
Patent Assignment
Reel/Frame 063777/0721

Assignment of Assignor's Interest

Recorded: 2023-05-26 Pages: 8
Assignors
LIU, WEN
Executed: 2023-03-20
LI, XIN
Executed: 2023-03-20
CUI, ZHIXIN
Executed: 2023-03-20
Assignees
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO.1188 HEZUO RD., (WEST ZONE), HI-TECH DEVELOPMENT ZONE, CHENGDU, SICHUAN, 611731, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO.10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property (1)
Flexible Printed Circuit Board and Method for Manufacturing the Same, and Display Device
Application: 18/254,816 →
Publication: US 2024/0397608
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 16, 2025
From: BOE TECHNOLOGY GROUP CO., LTD.
To: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Reel/Frame 072881/0322 →