Patent Assignment
Reel/Frame 063800/0862
Assignment of Assignor's Interest
Recorded: 2023-05-30
Pages: 8
Assignors
YU, TA-JEN
Executed: 2023-05-02
TSAI, WEN-CHIN
Executed: 2023-05-02
SONG, ISABELLA
Executed: 2023-05-02
CHEN, TAI-YU
Executed: 2023-05-03
KUO, CHE-HUNG
Executed: 2023-04-27
LIU, HSING-CHIH
Executed: 2023-04-28
LIN, SHIH-CHIN
Executed: 2023-05-02
HSU, WEN-SUNG
Executed: 2023-05-02
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Package-On-Package Having a Thick Logic Die
Application:
18/203,631 →
Publication:
US 2023/0307421