IP Library › Assignment 063808/0630
Patent Assignment
Reel/Frame 063808/0630

Change of Name

Recorded: 2023-05-31 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Large Metal Pads Over Tsv
Application: 16/439,622 →
Publication: US 2019/0385966
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 22, 2019
From: GAO, GUILIAN; LEE, BONGSUB; FOUNTAIN, GAIUS GILLMAN, JR.; UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 051086/0557 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →