Patent Assignment
Reel/Frame 063813/0483
Assignment of Assignor's Interest
Recorded: 2023-05-31
Pages: 6
Assignors
HUH, JAEYOUNG
Executed: 2023-04-21
LIM, JONGHOON
Executed: 2023-04-21
KWON, OHHYUCK
Executed: 2023-04-21
HWANG, AHREUM
Executed: 2023-04-21
PARK, SUNGCHUL
Executed: 2023-04-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Foldable Electronic Device Comprising Heat-Dissipating Structure