Patent Assignment
Reel/Frame 063817/0911
Assignment of Assignor's Interest
Recorded: 2023-05-31
Pages: 6
Assignors
OH, DONGJOON
Executed: 2023-04-20
PARK, JUMYONG
Executed: 2023-04-20
SONG, SOLJI
Executed: 2023-04-20
JUNG, HYUNCHUL
Executed: 2023-04-20
CHO, SANGHOO
Executed: 2023-04-20
HWANG, HYUNSU
Executed: 2023-04-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Semiconductor Package
Application:
18/141,519 →
Publication:
US 2024/0145366