Patent Assignment
Reel/Frame 063850/0075
Assignment of Assignor's Interest
Recorded: 2023-06-05
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method, Apparatus, and System with Integrated Circuit Manufacturing
Application:
18/328,848 →
Publication:
US 2024/0213220