Patent Assignment
Reel/Frame 063864/0554
Assignment of Assignor's Interest
Recorded: 2023-06-06
Pages: 10
Assignors
LEE, MANHO
Executed: 2023-04-27
SEO, JUNGMIN
Executed: 2023-04-27
SHIN, KWANGSEOB
Executed: 2023-05-19
CHOI, WOOSIN
Executed: 2023-04-27
CHOI, JUNGHWAN
Executed: 2023-04-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Buffer Chip Bonded to Memory Dies Using Wires
Application:
18/206,201 →
Publication:
US 2024/0055395