Patent Assignment
Reel/Frame 063945/0806
Assignment of Assignor's Interest
Recorded: 2023-06-14
Pages: 2
Assignor
JACOB, GEORGE C.
Executed: 2017-06-20
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property
(1)
Chemical Mechanical Polishing Pads for Improved Removal Rate and Planarization
Application:
18/322,005 →
Publication:
US 2023/0294240
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 14, 2023
From: WEIS, JONATHAN G.; CHIOU, NAN-RONG; QIAN, BAINIAN
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 063945/0735 →
Change of Name
Jun 27, 2025
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 071765/0928 →