Patent Assignment
Reel/Frame 064004/0498
Assignment of Assignor's Interest
Recorded: 2023-06-21
Pages: 12
Assignors
CHEN, HSIN-HSIEN
Executed: 2023-06-14
HSUEH, SHENG-YUAN
Executed: 2023-06-14
TSENG, KUN-SZU
Executed: 2023-06-14
LEE, KUO-HSING
Executed: 2023-06-14
KANG, CHIH-KAI
Executed: 2023-06-14
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Fabricating Method of the Same
Application:
18/212,188 →
Publication:
US 2024/0387523