Patent Assignment
Reel/Frame 064232/0067
Assignment of Assignor's Interest
Recorded: 2023-07-12
Pages: 5
Assignors
CHEN, MING-YAO
Executed: 2023-07-12
CHANG, CHIEN-WEI
Executed: 2023-07-12
TU, CHIH-HUNG
Executed: 2023-07-12
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Through-Substrate-Via in Photosensitive Module
Application:
18/350,445 →
Publication:
US 2024/0021649