Patent Assignment
Reel/Frame 064232/0420
Assignment of Assignor's Interest
Recorded: 2023-07-12
Pages: 4
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Packaging Structure and Method of a Photosensitive Module
Application:
18/350,474 →
Publication:
US 2024/0021650