Patent Assignment
Reel/Frame 064235/0835
Change of Name
Recorded: 2023-07-10
Pages: 11
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Method for Manufacturing Electronic Component, Resin Composition for Temporary Fixing, Resin Film for Temporary Fixing, and Resin Film Sheet for Temporary Fixing
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 22, 2018
From: MAKINO, TATSUYA; SOBUE, SHOGO; TOKUYASU, TAKAHIRO; ISHI, MANABU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 047257/0835 →
Change of Name
Jan 5, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054809/0501 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →