Patent Assignment
Reel/Frame 064416/0351
Assignment of Assignor's Interest
Recorded: 2023-07-28
Pages: 10
Assignors
HAO, WEI
Executed: 2023-05-23
ZHANG, JUNWEI
Executed: 2023-05-23
ZHANG, XIAOYU
Executed: 2023-05-23
SHI, LINGYUN
Executed: 2023-05-23
Assignees
BOE MLED TECHNOLOGY CO., LTD.
NO.8 XIHUANZHONG RD., BDA, BEIJING, 100176, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO.10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Driver Chip, Light-Emitting Substrate and Testing Method Thereof, and Display Apparatus